Mediatek Helio X30 specs: Mediatek X30 brings 10nm deca-core computing for 2017

Mediatek Helio X30 is the new deca core chipset and is said to be making use of 10nm manufacturing for better performance and greater energy efficiency calculation. It will be used in top of the range smartphones in 2017.

Mediatek Helio X30 specs

Mediatek Helio X30 specs include UFS 2.1 storage, 8GB of LPDDR4 RAM, PowerVR series 7 and will incorporate advanced modems. This processor si the first processor to make use of 10nm manufacturing technology which is a big step forward as until now all mediatek chips make use of 28nm or 16nm process.

The new Mediatek Helio X30 would bring significant improvements in performance and energy savings.

MediaTek has also confirmed the shift from ARM Mali graphics to the PowerVR Series 7. At the moment we do not know the production and availability times, but we are sure that the first devices equipped with this chip will hit the market in 2017.

Details of cores:

4 Cortex-A72 cores running at 2.5 GHz
2 Cortex-A72 cores running at 2.0 GHz
2 Cortex-A53 cores running at 1.5 GHz
2 Cortex-A53 cores running at 1.0 GHz

Hardware specs:

2 x LPDDR4 RAM ePOP (indicating that the SoC will be an ‘all in on package’)
Up to 4 GB eMMC 5.1
ARM Mali-T880
Support up to a 40 MP rear camera sensor (that can record videos at that resolution at a steady 24 FPS)

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